The TAPPI PLACE Division held it's annual conference in Seattle, WA, May 6-9th. For a complete conference wrap-up, photos, and more on presentations you might have missed [Read More]
he Technical Association of the Pulp and Paper Industry (TAPPI) will offer a new scholarship designed for students pursuing a career in the field of packaging thanks to a recent gift. The Daniel Siegel Memorial Scholarship was funded by the Siegel family and MICA Corporation in honor of Daniel Siegel, founder and chair of MICA Corp.
The TAPPI PLACE Division is proud to partner with BNP Media to provide a resource specifically for our PLACE Division members. As a PLACE member you can now obtain Flexible Packaging Magazine as a free member benefit and Packaging Strategies Newsletter at discounted rates. Please visit our publications page for more information.
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