PLACE



2012 TAPPI PLACE Conference Highlights

The TAPPI PLACE Division held it's annual conference in Seattle, WA, May 6-9th. For a complete conference wrap-up, photos, and more on presentations you might have missed [Read More]

New TAPPI Daniel Siegel Memorial Scholarship to Be Offered in Field of Packaging

he Technical Association of the Pulp and Paper Industry (TAPPI) will offer a new scholarship designed for students pursuing a career in the field of packaging thanks to a recent gift. The Daniel Siegel Memorial Scholarship was funded by the Siegel family and MICA Corporation in honor of Daniel Siegel, founder and chair of MICA Corp.

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New Resource for PLACE members

The TAPPI PLACE Division is proud to partner with BNP Media to provide a resource specifically for our PLACE Division members. As a PLACE member you can now obtain Flexible Packaging Magazine as a free member benefit and Packaging Strategies Newsletter at discounted rates. Please visit our publications page for more information.

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