Position Yourself This Year to See Beyond 2020
TAPPI’s 2020 International Flexible Packaging and Extrusion Division Conference is April 19 – 22, at the InterContinental Hotel in San Diego, California. The theme focuses on the Vision of Packaging and Converting: Seeing Beyond 2020.
This premier technical conference will bring together some of the industry’s top leaders who will share insights on the future of flexible packaging. The conference features keynote speakers Alison Keane, Esq., CAE, President and Chief Executive Officer of Flexible Packaging Association, and George G. Misko, Esq., Partner, Keller and Heckman, LLP.
Conference program topics are designed to give you the latest, cutting-edge information about the future of packaging and converting, including:
» Consumer Perspectives on Plastic Packaging
» Technical Advances in Recycling
» Millennial Perspectives on Sustainability
» The Circular Economy for Multilayer Plastic Webs
» Advancements in Coating, Recycling, Equipment and Barrier Performance
During the conference, the recipient of the biennial Daniel Siegel Memorial Scholarship Fund will be announced. This $4,000 scholarship is open to TAPPI Student Chapter members enrolled in a packaging or related major. Applications are due to TAPPI’s International Flexible Packaging and Extrusion Division by Saturday, February 15. The scholarship is funded by an endowment from MICA Corporation and the Siegel Family. To download an application, visit the Division website.