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Journal articles
Open Access
Using dynamic mechanical spectroscopy to improve the performance of hot melt adhesives, TAPPI JOURNAL March 1989

Using dynamic mechanical spectroscopy to improve the performance of hot melt adhesives, TAPPI JOURNAL March 1989

Journal articles
Open Access
Downgauge paper overwrap films using mlldpe blends, TAPPI JOURNAL, April 2000, Vol. 83(4)

Downgauge paper overwrap films using mlldpe blends, TAPPI JOURNAL, April 2000, Vol. 83(4)

Journal articles
Open Access
High-value adhesives for a low-cost process, TAPPI JOURNAL, August 1997, Vol. 80(8)

High-value adhesives for a low-cost process, TAPPI JOURNAL, August 1997, Vol. 80(8)

Journal articles
Open Access
Improved extrudable hot-melt melt adhesive for lidding, TAPPI JOURNAL, August 1997, Vol. 80(8)

Improved extrudable hot-melt melt adhesive for lidding, TAPPI JOURNAL, August 1997, Vol. 80(8)

Journal articles
Open Access
High-barrier packaging with liquid crystal polymers, TAPPI JOURNAL, June 1997, Vol. 80(6)

High-barrier packaging with liquid crystal polymers, TAPPI JOURNAL, June 1997, Vol. 80(6)

Journal articles
Open Access
The effect of layer geometry on the layer adhesion of coextruded films, TAPPI JOURNAL, May 1997, Vol. 80(5)

The effect of layer geometry on the layer adhesion of coextruded films, TAPPI JOURNAL, May 1997, Vol. 80(5)

Journal articles
Open Access
Formulating deep freeze hmas - a statistical approach to predict performance properties, TAPPI JOURNAL, September 1997, Vol. 80(9)

Formulating deep freeze hmas - a statistical approach to predict performance properties, TAPPI JOURNAL, September 1997, Vol. 80(9)

Journal articles
The Use of Mettallocene polyethylene in Coextruded Lamination Films, 2006 PLACE Conference

The Use of Mettallocene polyethylene in Coextruded Lamination Films, 2006 PLACE Conference

Journal articles
The Effects of Corona and Flame Treatment

The Effects of Corona and Flame Treatment

Journal articles
On-line Gauging as a Process Troubleshooting Tool, 2006 PLACE Conference

On-line Gauging as a Process Troubleshooting Tool, 2006 PLACE Conference