Abstracts Sought for TAPPI’s FlexPack PLACE Conference

(ATLANTA) August 14, 2023 – Flexible packaging subject matter experts are invited to submit abstracts to TAPPI’s 2024 FlexPack PLACE Conference before September 1, 2023.

The event’s Technical Programming Committee is actively seeking technical presentations, case studies, and papers from the professional packaging and academic communities. Selected presentations will be presented at FlexPack PLACE, April 14-17, 2024 in San Diego, CA.

Suggested topics include:

• Advances in Resin Technologies
• Advances in Barrier and Package Performance Properties
• Advances in Material & Packaging Design
• Advances in Material & Packaging Structure Processing
• Advances in Extrusion Processing Equipment and Related Auxiliary Equipment
• Advances in Downstream Packaging Equipment
• Advances in Specialty Films and Coatings
• Advances in Bio-degradable and Bio-based Materials

Abstracts should be 300 words or less and must be submitted through the secured TAPPI Speaker Management System. Acceptances will be issued by September 15, 2023.

In addition to paper submissions, the Committee is also seeking professionals in the field interested in serving on panels, roundtables or other sessions, or who have an interest in serving as session developers.

“At FlexPack PLACE, presenters have the opportunity to share their latest research findings and industry advancements across the entire supply chain – from consumer packaged goods and pharma to food and beverage and more,” said Technical Program Chair Ankush Gokhale. “That means your presentation can be the spark that inspires the next innovation.”

To learn more about the 2024 Conference, visit events.tappiflexible.org or contact Division Manager Mary Beth Cornell by email or by phone at 404-510-0696.